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Datasheet
Tire Pressure Monitoring Sensor SP30
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Datasheet Tire Pressure Monitoring Sensor SP30
Revisions dates: 00 2003-01-03 1 2004-01-15 2 2005-11-25 3 2006-03-03 4 2008-08-29 5 2009-06-30 Document history: See end of document
Stamp
Date Prepared Checked Approved 030131 030625 030625
Sign AuR RH AuR
Rev 00 3 4
Reference Arkiv EM EM 49/03 11148 12194
Date 030630 060309
Dok HKW
Table of contents
1 PRODUCT DESCRIPTION.......................................................................................................................................4 1.1 1.2 1.3 2 Overview...........................................................................................................................................................4 Features ...........................................................................................................................................................4 Ordering Information ........................................................................................................................................4
PRODUCT CHARACTERISTICS.............................................................................................................................5 2.1 Measurement performance ..............................................................................................................................5 2.1.1 Pressure measurement................................................................................................................................5 2.1.2 Acceleration measurement ..........................................................................................................................6 2.1.3 Temperature measurement .........................................................................................................................6 2.1.4 Supply voltage measurement ......................................................................................................................6 2.2 2.3 2.4 Current consumption ........................................................................................................................................7 Tmax.................................................................................................................................................................7 Vmin .................................................................................................................................................................7
2.5 Clock sources ...................................................................................................................................................8 2.5.1 System clock (MCLK)...................................................................................................................................8 2.5.2 Low Power (LP) oscillator ............................................................................................................................8 2.5.3 External clock...............................................................................................................................................8 2.6 2.7 2.8 3 4 5 LF input.............................................................................................................................................................8 Power-on reset .................................................................................................................................................9 Digital I/O..........................................................................................................................................................9
RECOMMENDED OPERATING CONDITIONS.......................................................................................................9 ABSOLUTE MAXIMUM RATINGS ........................................................................................................................10 PHYSICAL DIMENSIONS AND MARKING ...........................................................................................................11 5.1 5.2 Physical Dimensions ......................................................................................................................................11 Marking...........................................................................................................................................................12
6 7
PIN CONFIGURATION...........................................................................................................................................13 DOCUMENT HISTORY ..........................................................................................................................................14
Datasheet
Tire Pressure Monitoring Sensor SP30
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Edition 2009-06-30 Published by Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg, Germany (c) Infineon Technologies AG 2006. All Rights Reserved. The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Datasheet
Tire Pressure Monitoring Sensor SP30
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1 Product Description
1.1 Overview The SP30 Tire Pressure Monitoring (TPM) Sensor represents Infineon's standard pressure range TPM sensor. The SP30 offers a high level of integration by including a microcontroller, signal conditioning and LF-input stage to meet market demands for flexible, customer specific solutions and overall system cost reduction. The sensor design is based on Infineon's proprietary and patented solutions for high reliability measurements in harsh automotive environments. Its predictable and stable quality is proven in high volume applications. The SP30 measures pressures up to 900kPa, temperature, supply voltage and acceleration (optional), and by integrating these functions with an ASIC in one package, Infineon has developed the ideal product for standard pressure TPM applications. 1.2 * Features Integrated Sensors o Pressure o Acceleration (optional) o Temperature o Voltage Integrated Peripherals o Microcontroller o On board EEPROM o GPIOs o ADC for signal conditioning o 2x LF Receiver for triggering Measurement Ranges o Pressure Sensor 100 to 450 kPa / 100 to 900kPa o Temperature Sensor -40 to +125C o Supply Voltage Sensor 2.1 to 3.6 V o Acceleration Sensor -12 to 115 g
*
*
1.3
Ordering Information Product Type 100...450kPa 100...900kPa 100...450kPa, no acceleration sensor 100...900kPa, no acceleration sensor Ordering Code SP000435430 SP000477044 SP000477042 SP000477040 Package P-DSOSP-14-6 P-DSOSP-14-6 P-DSOSP-14-6 P-DSOSP-14-6
Product Name SP300V5.0-E106-0 SP300V5.0-E116-0 SP300V5.0-E206-0 SP300V5.0-E216-0
Datasheet
Tire Pressure Monitoring Sensor SP30
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2 Product Characteristics
The max and min values are to be understood as + and - 5 values (Cpk = 1.67) unless otherwise specified. 2.1 Measurement performance
2.1.1 Pressure measurement The presented performance reflects the use of 11-bit measurement of pressure signal and 10-bit measurement of temperature. 2.1.1.1 Standard pressure measurement range
Table 1 Pressure measurement specifications, 100-450kPa range PARAMETER Pressure range Measurement error Min 100 -7 -9 -17.5 SPECIFICATION Typ Max 450 7 9 17.5 Unit kPa kPa kPa kPa AMBIENT CONDITIONS Temp [C] VDD [V] -40 to 125 2.1 to 3.6 0 to 50 2.1 to 3.6 50 to 70 2.1 to 3.6 -40 to 125 2.1 to 3.6 COMMENTS
2.1.1.2
Optional pressure measurement ranges
Table 2 Pressure measurement specifications, 100-700kPa range SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [C] VDD [V] Pressure range 100 700 kPa -40 to 125 2.1 to 3.6 Measurement error -11 11 kPa 0 to 50 2.1 to 3.6 -14 14 kPa 50 to 70 2.1 to 3.6 -28 28 kPa -40 to 125 2.1 to 3.6 Table 3 Pressure measurement specifications, 100-800kPa range PARAMETER Pressure range Measurement error Min 100 -12.5 -16 -19.5 SPECIFICATION Typ Max 800 12.5 16 19.5 Unit kPa kPa kPa kPa AMBIENT CONDITIONS Temp [C] VDD [V] -40 to 125 2.1 to 3.6 0 to 50 2.1 to 3.6 50 to 70 2.1 to 3.6 -40 to 125 2.1 to 3.6
COMMENTS
COMMENTS
Table 4 Pressure measurement specifications, 100-900kPa range PARAMETER Pressure range Measurement error Min 100 -14 -18 -35 SPECIFICATION Typ Max 900 14 18 35 Unit kPa kPa kPa kPa AMBIENT CONDITIONS Temp [C] VDD [V] -40 to 125 2.1 to 3.6 0 to 50 2.1 to 3.6 50 to 70 2.1 to 3.6 -40 to 125 2.1 to 3.6 COMMENTS
Datasheet
Tire Pressure Monitoring Sensor SP30
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2.1.2 Acceleration measurement The presented performance reflects the use of 12-bit measurement of acceleration signal and 10-bit measurement for temperature. Table 5 Acceleration measurement specifications PARAMETER Input range Sensitivity accuracy Offset accuracy Min -12 -18.75 -6 -8.5 SPECIFICATION Typ Max Unit 115 g 18.75 % 6 g 8.5 g AMBIENT CONDITIONS Temp [C] VDD [V] -40 to 90 2.1 to 3.6 -40 to 90 2.1 to 3.6 -20 to 70 2.1 to 3.6 -40 to 90 2.1 to 3.6 COMMENTS
2.1.3 Temperature measurement The presented performance reflects the use of 10-bit measurement of temperature. Table 6 Temperature measurement specifications PARAMETER Measurement error Min -3 -5 -3 SPECIFICATION Typ Max 3 5 7 Unit C C C AMBIENT CONDITIONS Temp [C] VDD [V] -20 to 70 2.1 to 3.6 -40 to 90 2.1 to 3.6 90 to 125 2.1 to 3.6 COMMENTS
2.1.4 Supply voltage measurement The presented performance reflects the use of 9-bit measurement of supply voltage. Table 7 Supply voltage measurement specifications PARAMETER Measurement error Min -100 SPECIFICATION Typ Max Unit +100 mV AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 VTHR to 3.6 COMMENTS
Datasheet
Tire Pressure Monitoring Sensor SP30
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2.2
Current consumption
Table 8 Current consumption PARAMETER Power down current Power down current IDLE current IDLE current RUN current RUN current Pressure measurement Acceleration measurement Temperature measurement Supply voltage measurement Peak current Min SPECIFICATION Typ Max Unit 0.4 0.6 A 13 20 A 30 50 A 50 75 A 0.53 0.8 mA 0.65 1.0 mA 4 12 As 6 0.9 0.3 1.6 16 2.5 2.5 2.5 As As As mA AMBIENT CONDITIONS Temp [C] VDD [V] 25 3.0 125 3.0 25 3.0 125 3.0 25 3.0 125 3.0 -40 to 125 2.1 to 3.6 -40 to 125 -40 to 125 -40 to 125 25 2.1 to 3.6 2.1 to 3.6 2.1 to 3.6 3.0 COMMENTS
11 bit A/D conversion, excl. temperature meas 12 bit A/D conversion, excl. temperature meas 10 bit A/D conversion 9 bit A/D conversion Pressure measurement and 1 LF channel on, duration is 1280s for 11 bit measurement for the peak current only. 2 LF channel is optional nd 2 LF channel is optional
nd
1 channel LF current 1 channel LF current 2 channel LF current 2 channel LF current Thermal shutdown current Thermal shutdown current 2.3 Tmax
2.6 3.0 4.5 6.5 18 30
4.6 6.7 5.5 11 25 50
A A A A A A
25 125 25 125 125 150
3.0 3.0 3.0 3.0 3.0 3.0
SHTD represents the temperature at which the Thermal Shut-down function can be enabled and REL represents the temperature at which the Master Reset state is released. The SHTD is always higher than REL. Table 9 Trigger temperatures for thermal shutdown PARAMETER SHTD REL Min 102 100 SPECIFICATION Typ Max Unit 123 C 121 C AMBIENT CONDITIONS COMMENTS TEMP [C] VDD [V] -40 to 175 2.1 to 3.6 Thermal shutdown enable -40 to 175 2.1 to 3.6 Master Reset release
2.4 Vmin The voltage at which the Vmin-circuit will return a low battery voltage status is specified in Table 10: Table 10 Vmin specifications PARAMETER Vmin Min 2.0 SPECIFICATION Typ Max Unit 2.1 2.2 V AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 VTHR to 3.6 COMMENTS
Datasheet
Tire Pressure Monitoring Sensor SP30
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2.5 2.5.1
Clock sources System clock (MCLK)
Table 11 System clock (MCLK) specifications PARAMETER MCLK frequency 2.5.2 Min 1.8 SPECIFICATION Typ Max Unit 2.0 2.2 MHz AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 2.1 3.6 COMMENTS
Low Power (LP) oscillator
Table 12 LP oscillator specifications PARAMETER Tit del2t LP oscillator accuracy 2.5.3 External clock SPECIFICATION Min Typ Max Unit 0.5, 1.0, 2.0 or 4.0 s 25, 50, 75 or 100 ms -20 20 % AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 2.1 to 3.6 -40 to 125 2.1 to 3.6 -40 to 125 2.1 to 3.6 COMMENTS Interval timer main tick Delay to extra tick
Table 13 External clock specifications PARAMETER External clock 2.6 LF input Min SPECIFICATION Typ Max Unit 3.5 MHz AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 2.1 to 3.6 COMMENTS
Table 14 LF telegram PARAMETER Modulation Carrier frequency Preamble period Data rate Settling time AMBIENT CONDITIONS COMMENTS TEMP [C] VDD [V] -40 to 125 2.1 to 3.6 kHz -40 to 125 2.1 to 3.6 ms -40 to 125 2.1 to 3.6 kHz -40 to 125 2.1 to 3.6 ms -40 to 125 2.1 to 3.6 Time from LF interface is turned on by RISC to the LF interface is active 5 mVp-p -40 to 125 2.1 to 3.6 10 12 pF -40 to 125 2.1 to 3.6 500 -40 to 125 2.1 to 3.6 k The input signals from the enabled LF channels are rectified and real time summed Min Unit SPECIFICATION Typ Max ASK 121.25 125 128.75 4 3.84 3.9 3.96 2
Detection threshold Input capacitance Input resistance Other
Datasheet
Tire Pressure Monitoring Sensor SP30
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Table 15 LF Carrier Detection PARAMETER Carrier frequency Maximum sensitivity not to detect, 2 amplifiers enabled Minimum sensitivity to detect, 2 amplifiers enabled Maximum sensitivity not to detect, 3 amplifiers enabled Minimum sensitivity to detect, 3 amplifiers enabled 2.7 Power-on reset Min 121.25 4 3.5 3.5 2.9 10 12.2 12.2 0.25 0.25 2.5 SPECIFICATION Typ Max 125 128.75 Unit kHz mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p mVp-p AMBIENT CONDITIONS TEMP [C] VDD [V] -40 to 125 2.1 to 3.6 0 to 90 2.1 to 3.6 90 to 125 2.1 to 3.6 -40 to 0 2.1 to 3.0 -40 to 0 3.0 to 3.6 0 to 90 2.1 to 3.6 90 to 125 2.1 to 3.6 -40 to 0 2.1 to 3.6 -40 3.6 -40 2.1 to 3.0 0 to 125 2.1 to 3.6 -40 to 125 2.1 to 3.6 COMMENTS
0.8
Guaranteed by ASIC characterization Guaranteed by ASIC characterization
Table 16 Power-on reset level PARAMETER Power-on reset level, VTHR 2.8 Digital I/O Min 1.8 SPECIFICATION Typ Max Unit 1.85 1.9 V COMMENTS
Table 17 Digital I/O specifications PARAMETER Digital output high Digital output low Digital input high Digital input low Input current SPECIFICATION COMMENTS Min Typ Max Unit VDD-0.3 V At 1 mA load current 0.3 V At 1 mA load current V 0.8VDD V 0.2VDD 1 A
3 Recommended Operating Conditions
Table 18 Recommended operating conditions PARAMETER Supply voltage Ambient temperature Min VTHR -40 SPECIFICATION Typ Max Unit 3.6 V 125 C COMMENTS Unless otherwise specified
Datasheet
Tire Pressure Monitoring Sensor SP30
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4 Absolute Maximum Ratings
Table 19 Absolute maximum ratings PARAMETER Ambient temperature, operating Ambient temperature, storage 1 Transient temperature Supply Voltage Input voltage Input current, any pin (DC) Input current, any pin (transient) Input current, LF pins Maximum input pressure Burst pressure Static acceleration Mechanical shock ESD Latch Up Min -40 -40 -0.3 -0.3 -10 -100 -1 1400 2000 2 200 100 SPECIFICATION Typ Max 150 150 175 4.0 Vdd+0.3 10 100 1 2000 4000 Unit C C C V V mA mA mA kPa kPa g g kV V mA COMMENTS Max 24 hrs accumulated over life time Max 1000 hours Max 3 min
Half sine, 0.3ms Human body model AEC-Q100 Machine model AEC-Q100 AEC-Q100
Attention: Stress beyond the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device.
1
Will withstand standard reflow soldering process (JEDEC JESD22-B102-C)
Datasheet
Tire Pressure Monitoring Sensor SP30
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5 Physical Dimensions and Marking
5.1 Physical Dimensions
Figure 1: Physical Dimensions - Drawing P-DSOSP-14-6 1) Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs do not exceed 0.15mm (0.006 inch) per side. 2) Dimension does not include inter-lead flash or protrusions. Inter-lead flash and protrusions do not exceed 0.25mm (0.010 inch) per side.
Datasheet
Tire Pressure Monitoring Sensor SP30
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5.2
Marking
Figure 2 Marking of the SP30 The variables in Figure 2 have the following meaning: KKJWWNNNSXX: YYWW: ZZZZZ: NNNNN: O: Infineon Lot Number Date Code (YY = Year, WW = week) Product Optional Marking Pin 1 Marking
Datasheet
Tire Pressure Monitoring Sensor SP30
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6 Pin Configuration
Figure 3: Pin Configuration. Top view, not to scale
Table 20 Pin Description PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 NAME IN4 P10 P11 MSDA MSCL VDD VSS VSS P17 P15 P14 IN1 IN2 IN3 FUNCTION LF receiver channel 2, negative input General purpose I/O with external wakeup, internal pull-up/pull-down General purpose I/O with external wakeup, internal pull-up/pull-down Monitor Serial Data I/O, internal pull-up Monitor Serial Clock input Supply pad VDD (battery, positive terminal) Common ground (battery, negative terminal) Common ground (battery, negative terminal) General purpose I/O (or digital modulator output) General purpose I/O or external clock General purpose I/O (or digital modulator output) LF receiver channel 1, positive input LF receiver channel 1, negative input LF receiver channel 2, positive input
Datasheet
Tire Pressure Monitoring Sensor SP30
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7 Document history
Rev 00 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 3 3 3 4 4 4 4 4 4 4 5 Paragraphs 1.1.1.2 1.1.3 1.2 1.2 1.2 1.2 1.2 1.6 1.6 3 3 3 1.1.1 1.1.1 4.1 1.1.1 1.6 1.8 1 5 6 4 2.1.1.2 5.2 Description First issue of TS1085 (identical to TS0212P rev C) Added objective specification for 1400 kPa sensor Temperature accuracy above +90 C improved to -3 C Temperature measurement max value 2.5 As Supply voltage measurement max value 2.5 As Added peak current measurement 1 channel LF current, 25 C, max value 4.6 A 1 channel LF current, 125 C, max value 6.7A LF input capacitance max value included LF input resistor min value included, typical value removed, comment removed Ambient temperature, storage, max 1000 hrs Input currents specified Maximum input pressure and burst pressure values listed in minimum column (All tables) Added specification point between 50 and 70 C to meet ISO standard Added specification for 800 kPa Updated reference to physical dimensions and marking Improved specification for 800 kPa, outer temperatures LF CD updated Output high/low values corrected (min/max swapped) Removed "Confidential" Marking Added Disclaimer Added Section "Product Description" Added Section "Physical Dimension and Marking" Added Section "Pin Configuration" Added note to maximum ratings Removed 1400kPa option Updated marking

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